Function & Service
Transmittance/reflectivity
Light Intensity & distribution
Wavelength spectrum
Color temperature (CCT)
Chromaticity coordinate (CIE)
Luminous flux (lm)
Illuminance (Lux)
Color rendering index (CRI)
Dimension measurement
Optical structure optimization
Intensity & distribution analysis
Color analysis
Light efficiency. View angle analysis
Module signal. Cross talk analysis
Design Tool
The characteristics of packaging material are a major concern when determining how well the ICs will perform. HX's Material Laboratory provides the characterization analysis of the following properties. The related instruments are listed next. Users can find more information from the Measurement Equipment section.
Design information format:
GDS II
Microsoft office format netlist
Pad coordinator
Ball out
Design tool:
Cadence
Xynetix
Drawing offering:
Layout Drawing:
AutoCad R14
2000 Gerber RS 274X
Acrobat pdf Format
Bonding Diagram:
AutoCad R14, 2000
Acrobat pdf Format
基板设计服务
随着客户对电子产品的小型、薄型和高性能的要求,设备制造商正在寻找高性能、高可靠性和低成本的解决方案。基板/引线框架在封装工业中发挥了非常重要的作用,不仅因为它占成本的很大一部分,而且因为它对封装性能有很大影响。如何设计高性能、低成本的基板/ ...