• 随着客户对电子产品的小型、薄型和高性能的要求,设备制造商正在寻找高性能、高可靠性和低成本的解决方案。基板/引线框架在封装工业中发挥了非常重要的作用,不仅因为它占成本的很大一部分,而且因为它对封装性能有很大影响。如何设计高性能、低成本的基板/引线框架已成为所有封装公司的主要任务之一。在和项,我们拥有一批经验丰富的专业人员,致力于基板/引线框架设计,为客户提供交钥匙解决方案,以实现高性能、低成本和短时间上市。

    Function & Service
    Transmittance/reflectivity
    Light Intensity & distribution
    Wavelength spectrum
    Color temperature (CCT)
    Chromaticity coordinate (CIE)
    Luminous flux (lm)
    Illuminance (Lux)
    Color rendering index (CRI)
    Dimension measurement
    Optical structure optimization
    Intensity & distribution analysis
    Color analysis
    Light efficiency. View angle analysis
    Module signal. Cross talk analysis

    Design Tool
    The characteristics of packaging material are a major concern when determining how well the ICs will perform. HX's Material Laboratory provides the characterization analysis of the following properties. The related instruments are listed next. Users can find more information from the Measurement Equipment section.
    Design information format:
    GDS II
    Microsoft office format netlist
    Pad coordinator
    Ball out
    Design tool:
    Cadence
    Xynetix
    Drawing offering:
    Layout Drawing:
    AutoCad R14
    2000 Gerber RS 274X
    Acrobat pdf Format
    Bonding Diagram:
    AutoCad R14, 2000
    Acrobat pdf Format

基板设计服务

随着客户对电子产品的小型、薄型和高性能的要求,设备制造商正在寻找高性能、高可靠性和低成本的解决方案。基板/引线框架在封装工业中发挥了非常重要的作用,不仅因为它占成本的很大一部分,而且因为它对封装性能有很大影响。如何设计高性能、低成本的基板/ ...